Seavo Technology

SEAVO Embedded Computer HB03

SEAVO Embedded Computer HB03, featuring a pioneering modular design, delivers an overall 300TOPS of AI Computing Power with compact size and high reliability.

Based on SCM (Seavo Compute Module)

Intel Core Ultra Series 2 (Arrow Lake-H) Processors, with integrated NPU and iGPU, AI Computing Power up to 96TOPS

Support MXM Expansion GPUs, max expandable AI Computing Power up to 300 TOPS

Modular design, flexible customization supported

Thick Model 150*142*78mm, with independent GPUs; Slim Model 150*142*53mm

Driver Downloads

Specification

General
CPU	Intel^®Core™ Ultra Processors (Series 2) Processors, Arrow Lake-U/H, with NPU and iGPU, up to 96TOPS
Memory	LPDDR5X-7467, 4*SDRAM, up to 64GB
Storage	1*M.2 M-Key 2280, PCIe4.0 x4
Expansion	1MXM Slot, PCIe 4.0 x8, Support Intel^®Arc™ B570 Graphic Card 1M.2 E-Key 2230, PCIe x1 + USB2.0, support WiFi+BT 1M.2 E-Key 3042/3052, USB3.0 + USB2.0, support 5G/4G module 1Nano SIM
BIOS	AMI UEFI BIOS
OS	Windows 10/11 64bit, Linux
I/O
Ethernet	4Intel^®I210-AT NICs with EtherCAT Protocol, Type-C 1Intel^®GbE Controller, RJ45
Serial	2RS485, 2RS232
USB	4*USB3.0 Type-C
GMSL Expansion Card	4*GMSL, support Quad Channel GMSL Camera
GPIO Expansion Card	6GPI, 6GPO, 2tGPIO, 1TTL(12V+5V+3.3V)
Power Expansion Card	48V to 12V, 200W
Mechanical & Environment
Dimension	MAX: 15014278mm MIN: 15014253mm
Power Input	1*DC 12±5%, 2P XT30PW-M
Temperature	Operation: 0℃~60℃, Storage: -20℃~75℃
Relative Humidity	5%~95%, non-condensing