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SEAVO Embedded Computer HB03

SEAVO Embedded Computer HB03, featuring a pioneering modular design, delivers an overall 300TOPS of AI Computing Power with compact size and high reliability.

Based on SCM (Seavo Compute Module)
Intel Core Ultra Series 2 (Arrow Lake-H) Processors, with integrated NPU and iGPU, AI Computing Power up to 96TOPS
Support MXM Expansion GPUs, max expandable AI Computing Power up to 300 TOPS
Modular design, flexible customization supported
Thick Model 150*142*78mm, with independent GPUs; Slim Model 150*142*53mm
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