信步具身智能开发平台 HB03 以开创性的“大小脑融合”及模块化设计，整体算力达300TOPS，尺寸紧凑、可靠性高、便于开发迭代，推动具身智能真正落地到复杂实用场景中
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General |
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CPU |
Intel® Core™ Ultra Processors (Series 2) Processors, Arrow Lake-U/H, with NPU and iGPU, up to 96TOPS |
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Memory |
LPDDR5X-7467, 4*SDRAM, up to 64GB |
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Storage |
1*M.2 M-Key 2280, PCIe4.0 x4 |
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Expansion |
1*MXM Slot, PCIe 4.0 x8, Support Intel® Arc™ B570 Graphic Card 1*M.2 E-Key 2230, PCIe x1 + USB2.0, support WiFi+BT 1*M.2 E-Key 3042/3052, USB3.0 + USB2.0, support 5G/4G module 1*Nano SIM |
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BIOS |
AMI UEFI BIOS |
| OS | Windows 10/11 64bit, Linux |
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I/O |
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Ethernet |
4*Intel® I210-AT NICs with EtherCAT Protocol, Type-C 1*Intel® GbE Controller, RJ45 |
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Serial |
2*RS485, 2*RS232 |
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USB |
4*USB3.0 Type-C |
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GMSL Expansion Card |
4*GMSL, support Quad Channel GMSL Camera |
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GPIO Expansion Card |
6*GPI, 6*GPO, 2*tGPIO, 1*TTL(12V+5V+3.3V) |
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Power Expansion Card |
48V to 12V, 200W |
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Mechanical & Environment |
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Dimension |
MAX: 150*142*78mm MIN: 150*142*53mm |
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Power Input |
1*DC 12±5%, 2P XT30PW-M |
| Temperature |
Operation: 0℃~60℃, Storage: -20℃~75℃ |
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Relative Humidity |
5%~95%, non-condensing |
