信步与英特尔联合推出的智能自助模块化标准, Intel 6/7代Core i3/i5/i7处理器, Q170芯片
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General |
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CPU |
Intel® 6th and 7th Generation CoreTM i3/i5/i7, Pentium®, Celeron® CPU, LGA1151 |
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Chipset |
Intel® Q170 Chipset, TDP 6W |
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Memory |
DDR4-1866/2133, 2*SO-DIMM, up to 32 GB |
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Storage |
2*SATA 3.0 |
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Expansion Interface |
1*PCIe x1, 1*M.2 Key-E (2230, WiFi/BT),
1*M.2 Key-M (2280, NVME SSD), 1*M.2 Key-E (2230, Wifi+BT or Movidius M.2 module) |
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BIOS |
AMI UEFI BIOS |
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System |
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I/O Interface |
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Ethernet |
1*Intel® 1Gbps PCIe Ethernet Controller, RJ45 |
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Serial |
6*RS232 |
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USB |
2*USB 3.0, 6*USB 2.0 |
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Audio |
Realtek® ALC662 5.1 channel HDA Codec, with MIC/Line-out | |
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Feature Interface |
1*SVIO Header (provides 4*USB, 8*COM and Wifi/BT with SV-M5-CU) | |
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Display |
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Display Interface |
1*VGA: max resolution up to 1920*1200@60Hz 1*HDMI 2.0: max resolution up to 4096x2304@60Hz |
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Multiple Display |
Dual | |
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Mechanical & Environment |
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Dimension |
Compute Module: 175*150mm
I/O Module: 175*102mm
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Power Input |
DC 12V | |
| Temperature |
Operation: 0℃~60℃, Storage: -25℃~75℃ |
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Relative Humidity |
Operation: 10%~90%, Storage: 5%~95%, non-condensing | |
