SCM-DH113

SCM-D CPU Module, Intel 6/7/8/9th Gen Core i3/i5/i7 CPU with H110, DDR4 Memory, 2*Intel GbE

SCM-D (Seavo Compute Module based on Desktop platform)
Supports Intel 6/7/8/9th Gen Core i3/i5/i7 CPU with H110/ Q170 Chipset
Supports DDR4 Memory, provides 2*Intel GbE
Provides rich resources of I/O and Displays through B2B connectors
Fast to develop Carrier Board, flexible to select SCM CPU Module
146*105mm
Specifications
General
CPU

Intel® 6/7/8/9th Generation Core i3/i5/i7, Pentium®, Celeron® CPU,LGA1151

Max TDP 65W,Quad-core
Chipset
Intel® H110/ Q170, TDP 6W
Memory
DDR4-1866/2133, 2*SO-DIMM, up to 32 GB
BIOS
AMI UEFI BIOS
System
Windows 7/8.1/10, Linux
I/O
Ethernet
2*Intel® 1Gbps PCIe Ethernet Controller
Audio
1*Realtek® ALC662 5.1 channel HDA Codec
High Speed Signal

4*USB3.0, 4*SATA 3.0, 1*PCIe x16, 3*PCIe

When Chipset is Q170:

4*USB3.0, 4*SATA 3.0, 1*PCIe x16, 1*PCIe x4, 2*PCIe

2*HSIOA (USB 3.0/ PCIe), 2*HSIOB (SATA/ PCIe)
USB 2.0
8*USB 2.0
Serial
6*TTL
GPIO
4*programmable GPIO
Feature Interface

1*LPC, 1*SM BUS, 1*I2C, 1*SPI, 2*USB OC,

1*FAN Control, 1*Power Control, Power OK
Display
Display Interface

1*eDP, 1*VGA, 2*DDI

DDI can be set to DP/HDMI/DVI
Multiple Display
H110-Dual, Q170-Triple
Mechanical & Environment   
Dimension
146*105mm
Power Input
DC 12V, 5V
Temperature Operation: 0℃~60℃, Storage: -25℃~75℃
Relative Humidity
Operation: 10%~90%, Storage: 5%~95%, non-condensing
Variants
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