Seavo Technology

Smart Kiosk Module Reference Design jointly developed by SEAVO and INTEL, Intel 6/7th Gen Core i3/i5/i7 CPU with Q170

Smart Kiosk Module Reference jointly developed by SEAVO and INTEL

Fast develop I/O module to meet different application requirements

Simplified Maintenance and Easy Upgrades

Supports Intel 6/7th Gen Core i3/i5/i7 CPU with Q170 Chipset

3*M.2 (Support SSD, Wifi and Movidius Module)

6*COM, 13*USB, 1*Intel GbE LAN, supports vPro

Supports Dual display of VGA and HDMI

Driver Downloads

Specification

General
CPU	Intel^® 6^th and 7^th Generation Core^TM i3/i5/i7, Pentium^®, Celeron^® CPU, LGA1151
Chipset	Intel^®Q170 Chipset, TDP 6W
Memory	DDR4-1866/2133, 2*SO-DIMM, up to 32 GB
Storage	2*SATA 3.0
Expansion Interface	1PCIe x1, 1M.2 Key-E (2230, WiFi/BT), 1M.2 Key-M (2280, NVME SSD), 1M.2 Key-E (2230, Wifi+BT or Movidius M.2 module)
BIOS	AMI UEFI BIOS
System	Windows 7/8.1/10, Linux
I/O Interface
Ethernet	1*Intel^® 1Gbps PCIe Ethernet Controller, RJ45
Serial	6*RS232
USB	2USB 3.0, 6USB 2.0
Audio	Realtek^® ALC662 5.1 channel HDA Codec, with MIC/Line-out
Feature Interface	1SVIO Header (provides 4USB, 8*COM and Wifi/BT with SV-M5-CU)
Display
Display Interface	1VGA: max resolution up to 19201200@60Hz 1*HDMI 2.0: max resolution up to 4096x2304@60Hz
Multiple Display	Dual
Mechanical & Environment
Dimension	Compute Module: 175150mm I/O Module: 175102mm
Power Input	DC 12V
Temperature	Operation: 0℃~60℃, Storage: -25℃~75℃
Relative Humidity	Operation: 10%~90%, Storage: 5%~95%, non-condensing

Variants

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