Seavo Technology

Supports dual Intel 6th Gen Xeon Scalable processors, 32*DDR5-6400 R-DIMM, 21*MCIO 8i (PCIe5.0 x8)

Supports dual Intel 6th Gen Xeon Scalable processors

3*USB 3.2 Gen1, 1*COM, 21*MCIO 8i, expandable to 10*PCIe5.0 x16 GPU

4*CRPS redundant power supplies

Extensive expandability, ideal for AI training and deployment

OCSP standard, modular design, supports expansion of DC-SCM, OCP, BMC modules

Compatible with different daughter cards / 2U, 4U chassis options

Driver Downloads

Specification

General
CPU	6th Gen Intel^®Xeon^® Scalable Processors, 1+1 Socket LGA-4710 each processor supports Intel^® Ultra Path Interconnect (UPI) of up to 24 GT/s
Memory	DDR5-6400 (Max 8000MT/s), 32*ECC R-DIMM, up to 8TB
Storage	2*M.2(M.2 M-Key 2280, PCIe4.0 x2, NVMe)
Expansion	21MCIO 8i (PCIEx8 Gen5), support PCIEx16 Gen5 riser card or OCP 3.0 expansion 1DC-SCM, support front I/O chasis, with SEAVO I/O expansion card
BIOS	UEFI BIOS
OS	Server 2022/Ubuntu 25.04
I/O
Serial	1*RS232
USB	3*USB3.2 Gen1
Mechanical & Environment
Dimension	426*332mm
Power Input	4*CRPS/Power Plane
Temperature	Operation: 0℃~40℃, Storage: -20℃~75℃
Relative Humidity	5%~95%, non-condensing

Variants

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